Pefer High Bonding Strength Thermal-plastic Hot Melt Adhesive Film For Smart Cards

It has excellent low temperature performance and has met the ISO7816 standard.

Products Featrues:

1. ROHS certificated.

2. Whit glassine release paper

3. Transparent/amber-colored in adhesive glue

4. Width 29mm, thickness 70um, length 200m

5. Adhesive strength over 120N

6. Pre-bonding temperature: 90~140 °C; bonding temperature: 160~200°C

KH180 hot melt tape is designed for contact IC card ( specially for the SIM card), and was sold in the market since 2007. Relying on stable quality and excellent  performance, it has been widely accepted by customers and won the trust, as user’s demands are increasing, we enlarged investment in equipment and labor force, the current production capacity can reach over 10k rolls monthly.

If you are interested in our products, pls contact us via "TradeManager" . Other contact details is as follows:

ICQ: 639022540

Skype: lizzy0928

Pefer High Bonding Strength Thermal-plastic Hot Melt Adhesive Film For Smart Cards